I/We hereby acknowledge and confirm that any direct or indirect disclosure/provision of personal data of any person by me/us in this application form (including all supporting documents provided) is on a voluntary basis and shall not be in contravention of the provisions of the Personal Data (Privacy) Ordinance (Cap.486). The Company does not intend to collect such personal data of any person and such direct or indirect disclosure/provision of personal data of any person is not for any of the Company’s purpose for which personal data is being collected. I/We further agree that all information provided by me/us in this application form and such personal data relating to me/us collected by the Company from time to time may be used and disclosed for such purposes and to such persons (whether the recipient is located in Hong Kong or another country, or in a country that does not offer the same level of data protection as Hong Kong) in accordance with the Company’s policies on use and disclosure of personal data as set out in the Notice, which may be subject to changes from time to time. I/We have also responded to the Company’s intended use of my personal data for direct marketing, further acknowledge that I/we have been advised by the Company that I/we may exercise my/our opt-out right any time for not sending me/us with the direct marketing materials by notifying the Company.